Electronics & embedded systems · PCB & circuit design
Schematic to production-ready board — you own the files.
Circuit design and schematic capture, multilayer PCB layout and layer-stack design, signal integrity and EMC treated as design disciplines rather than late-stage tests, and design-for-manufacture (DFM) carried through to a production-ready package. Concept to a board your assembler can build. Every schematic, layout and source file is yours at close — a mutual NDA is standard before any detail is shared.
Vendor-neutral: no component, fab-house or assembler kickbacks. The only revenue is engineering time.
What we design
The board discipline, start to finish.
One senior engineer carries the design from schematic through to a package your fabricator and assembler can build against — the same person owns component selection, layout and the manufacturing handoff.
- 01
Schematic capture & circuit design
Circuit topology, component selection, power sequencing and protection circuits, DC–DC conversion, sensor interfaces and signal conditioning — captured to a schematic your team and your assembler can both read.
- 02
Multilayer PCB layout & stack-up
Layer count and stack-up proposed against density, speed and cost; component placement, routing and plane strategy for power delivery, thermal path and manufacturability.
- 03
Signal integrity & EMC as a design discipline
Controlled impedance, return-path planning, decoupling and clearance for EMC/EMI standards (CE/UKCA, FCC and others relevant to your market) built into the layout, not tested for afterwards.
- 04
Design-for-manufacture & production transfer
Footprint and land-pattern verification, panelisation, test-point and fixturing access, and tolerance to your assembler’s process — the handoff package that lets a board move to production without a re-spin.
Design-for-manufacture
A board that simulates is not a board that ships.
The most common failure in circuit design is not electrical — it is a design that works on the bench but cannot be built at cost, yield or lead time. DFM is treated as a design constraint from schematic capture onward, not a checklist run once layout is finished.
| Fabrication | Layer stack, trace/space and via geometry held to your fabricator’s standard process — no exotic requirements without a stated reason |
|---|---|
| Assembly | Footprints, land patterns and component orientation verified against IPC land-pattern guidance and your assembler’s placement capability |
| Test & fixturing | Test-point access and panelisation planned for in-circuit or flying-probe test, not added after layout is frozen |
| BOM & sourcing | Component selection reviewed for second-sourcing and obsolescence risk before it becomes a production problem |
When you need it
When to bring this in.
- A product concept has a defined function but no schematic, board or bill of materials yet
- An existing board has a known fault, an EMC failure, or needs a component re-spin for obsolescence
- A prototype works on the bench but needs to become a production-ready, manufacturable design
- A design was outsourced elsewhere and needs an independent, vendor-neutral review before committing to tooling
What you get
Deliverables you own.
Every engagement ships concrete design files your team keeps and can act on — never a report alone.
- Schematics — the captured circuit design, annotated and version-controlled
- Bill of materials (BOM) — component selection with sourcing and second-source notes
- PCB layout & Gerbers — full design files, drill files and assembly drawings
- DFM notes — the manufacturing constraints and rationale behind the layout, for your fabricator and assembler
Out of scope — this is not in-house volume manufacturing. We design the board and the production package, then liaise directly with your chosen fabricator and assembler through prototype build and production transfer — the design and the build stay independently owned.
Bring us the circuit, or the fault.
A short discovery call, a mutual NDA if you need one, then a scoped design plan.
FAQ
PCB & circuit design, answered.
Who owns the design once the work is done?
You do. Schematics, layout, Gerbers and every source design file transfer to you at project close — you commission the work, we deliver the output, you own it. Your design IP is yours from the first schematic. A mutual NDA is offered as standard before any technical detail changes hands.
Do you design for manufacture, or just for the schematic to work?
Design-for-manufacture (DFM) runs through the layout from the start, not as a late check: component footprint and land-pattern verification, panelisation, test-point and fixturing access, and tolerance to your chosen assembler's process capability. A board that simulates correctly but cannot be built at cost or yield is not a finished design.
How do you handle signal integrity and EMC?
As design disciplines built into the stack-up and routing, not a compliance test bolted on afterwards: controlled-impedance traces, return-path and layer-stack planning, decoupling and power-plane strategy, and clearance for the EMC/EMI standards your product needs to meet (CE/UKCA, FCC, or others relevant to your market). Getting this right in layout is materially cheaper than fixing it in a compliance lab.
How many layers does my board need?
It depends on component density, signal speeds, power delivery and cost target — there is no default answer. The layer stack is proposed during schematic capture, once the circuit, connector and enclosure constraints are known, and traded off against unit cost before layout begins.
Who actually manufactures the boards?
Not us. This is not in-house volume manufacturing — the deliverable is a production-ready design package (Gerbers, drill files, BOM, assembly drawings, DFM notes) that we hand to and liaise with your chosen fabricator and assembler, so the design and the build stay independent of each other.
Can you take an existing design and revise or debug it?
Yes. Bring an existing schematic, layout or a board with a known fault, and the same schematic-capture, layout and signal-integrity discipline applies to revision, re-spin or root-cause debugging as it does to a clean-sheet design.
How is this priced and scoped?
Day-rate, time-and-materials or fixed-scope against a written statement of work, agreed on a discovery call. No fixed monthly subscription and no percentage of a build cost — the fee is for engineering time and the design files it produces.